Provides optimized wafer probing solution through the combination
of high technology POGO probe and ultraprecision processing plate.
High-performance MEMS probe head, applied with MEMS process,
is capable of customized solution response by customer through low
force, high CCC, and outstanding contact characteristics of high-strength material.
POGO Probe Head | MEMS Probe Head | |
---|---|---|
Package Type |
Wafer (WLCSP) |
Wafer (SOC) |
Available Pitch |
120um~ |
80um~ |
Characteristics |
RF type, Signal length Solder Bump Wafer Probing & |
High CCC > 1A Copper Pillar (Flat type) Wire Bond Pad |
Pyramid PIN has high hardness (Hv1000), has outstanding contact
properties through durability and sharp contact tip, and can provide
customized solution response by customer.
POGO Probe Head | MEMS Probe Head | |
---|---|---|
Package Type |
Wafer (WLCSP) |
Wafer (SOC) |
Available Pitch |
120um~ |
80um~ |
Characteristics |
RF type, Signal length Solder Bump Wafer Probing & |
High CCC > 1A Copper Pillar (Flat type) Wire Bond Pad |
Based on the best technology and know-how, Lithium-Polymer Battery It is suitable for charging and discharging test.
POGO Probe Head | MEMS Probe Head | |
---|---|---|
Package Type |
Wafer (WLCSP) |
Wafer (SOC) |
Available Pitch |
120um~ |
80um~ |
Characteristics |
RF type, Signal length Solder Bump Wafer Probing & |
High CCC > 1A Copper Pillar (Flat type) Wire Bond Pad |
Provides RF test socket that responds to outstanding properties
and high frequency by matching the impedance through unequaled
technology and coaxial structure.
Coaxial Socket | RF Probe | |
---|---|---|
Package Type |
FBGA, LGA, QFN, WLCSP etc |
|
Available Pitch |
0.7P~ |
0.4P~ |
Characteristics |
50Ω Impedance Matching Coaxial Structure 40GHz Bandwidth |
Short Probe G-S-G > 40GHz @ -1dB Low Inductance Low CRES |