Products

ISTCU

  • Camera Module Socket

    ISC’s auto socket can be produced into different shapes that corresponds to customer’s needs. Also, based on long experience in test socket market, it guarantees the best contact property and durability, and has a different kind of driving system than existing ones.

    Specifications
    CCM Auto Socket MEMS Probe Head
    Package Type

    Bottom Move

    Top Move

    Available Pitch

    0.3, 0.35mm~

    0.3, 0.35mm~

    Characteristics

    Non-Magnetic

    Non-Magnetic

Product Series
Package Type

Around View

Pitch

0.35mm~

Characteristics

Non-Magnetic

Package Type

Twin VCM

Pitch

0.35mm~

Characteristics

Non-Magnetic

Package Type

VCM Module

Pitch

0.35mm~

Characteristics

Non-Magnetic

Package Type

Single Module

Pitch

0.35mm~

Characteristics

Non-Magnetic

Package Type

Triple Module

Pitch

0.35mm~

Characteristics

Non-Magnetic

Package Type

VCM Module

Pitch

0.35mm~

Characteristics

Non-Magnetic

  • Interposer

    ISC Interposer is a customizable product with high contact stability, where special rubber solution is applied according to customer’s needs.

    Specifications Package Type

    Board to Board, Probe card etc

    Available Pitch

    0.4P ~

    Characteristics

    High contact stability

    No board damage

    No bending

    Low force, Low Cres

Product Series
Package Type

B to B

Pitch

0.4P~

Characteristics

High contact stabilituy

No board damage

No bending

Low force, Low Cres

Package Type

Probe Card

Pitch

0.4P~

Characteristics

High contact stabilituy

No board damage

No bending

Low force, Low Cres

  • Test Fixture

    Capable of system test solution response against different packages, such as mobile, D-TV, network, module, etc., by using rubber and POGO socket.

    Specifications Package Type

    BGA, LGA, QFN etc

    Available Pitch

    0.3P~

    Characteristics

    Mobile Application Processor

    PMIC, RFIC, Memory IC, NFC

    Module, SSD, etc

Product Series
Package Type

748FBGA, 168FBGA

Pitch

0.4P~

Characteristics

Mobile AP + LPDDR Test

Package Type

64FBGA

Pitch

0.4P~

Characteristics

Mobile NFC Test

Package Type

96FBGA

Pitch

0.8P~

Characteristics

SSD Test

Package Type

556FBGA

Pitch

0.4P~

Characteristics

Mobile LPDDR Test

Package Type

153FBGA

Pitch

0.5P~

Characteristics

Navigation Test

Package Type

16LGA

Pitch

0.5P~

Characteristics

RF Chip Test

Package Type

556FBGA

Pitch

0.8P~

Characteristics

Module Test

Package Type

929FCPBGA

Pitch

0.75P~

Characteristics

D-TV Test

Package Type

48TSOP, 48QFP

Pitch

0.5P~

Characteristics

USB Test

  • Board Saver

    ISC Board saver will help to minimize the damage on the PCB pads from probes. Special Au particles on board saver will result great improvement on First Pass Yield with used PCB.

    Specifications Package Type

    All including BGA, QFN, QFP, TSSOP and etc

    Available Pitch

    0.35mm~

    Characteristics

    Minimize damage on PCB Pad

    Improve Test Yield

    Available for re-routing

    Simple installment and maintenance

  • Chiller
    Specifications
    Target Temp

    -40 ~ 120℃

    Heating Capacity.

    120℃ @360w

    Cooling Capacity(1Peltier)

    -40℃ @40w

    Cooling Capacity(2Peltier)

    -40℃ @80w

    Accuracy

    Target Temp±1℃

    Ramp Time(120℃ → -40℃)

    About 5min 30sec (±60sec)

    Ramp Time(-40℃ → 120℃)

    About 1min 30sec (±60sec)

    Power

    220V 50/60Hz
    (Max.5A@40w Controller
    Mx.10A@80w Controller)

    Dew point temperature

    Supply -30℃ Dry Air(40Lpm/1Dut)

    Need 1 chiller per 1 Thermal Head

  • Thermal Head + Controller
    (80W@-40℃ Type)
    Specifications
    Target Temp

    -40 ~ 120℃

    Heating Capacity.

    120℃ @360w

    Cooling Capacity(1Peltier)

    -40℃ @40w

    Cooling Capacity(2Peltier)

    -40℃ @80w

    Accuracy

    Target Temp±1℃

    Ramp Time(120℃ → -40℃)

    About 5min 30sec (±60sec)

    Ramp Time(-40℃ → 120℃)

    About 1min 30sec (±60sec)

    Power

    220V 50/60Hz
    (Max.5A@40w Controller
    Mx.10A@80w Controller)

    Dew point temperature

    Supply -30℃ Dry Air(40Lpm/1Dut)

    Need 1 chiller per 1 Thermal Head

  • Thermal Head + Controller
    (40W@-40℃ Type)
    Specifications
    Target Temp

    -40 ~ 120℃

    Heating Capacity.

    120℃ @360w

    Cooling Capacity(1Peltier)

    -40℃ @40w

    Cooling Capacity(2Peltier)

    -40℃ @80w

    Accuracy

    Target Temp±1℃

    Ramp Time(120℃ → -40℃)

    About 5min 30sec (±60sec)

    Ramp Time(-40℃ → 120℃)

    About 1min 30sec (±60sec)

    Power

    220V 50/60Hz
    (Max.5A@40w Controller
    Mx.10A@80w Controller)

    Dew point temperature

    Supply -30℃ Dry Air(40Lpm/1Dut)

    Need 1 chiller per 1 Thermal Head