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Burn In Socket
Provides customized, optimized solution through outstanding characteristics and structure, including Device No Ball Damage, PCB No Soldering, High Speed realization, etc., through rubber-applied Burn In Test Socket.
SpecificationsDC BI Socket Normal BI Socket High Speed BI Socket Package Type BGA, LGA etc.
BGA, LGA, QFN etc.
BGA etc.
Available Pitch 0.3P~
0.3P~
0.8P~
Characteristics Lifespan varies by test condition
No Ball Damage
Lifespan varies by test condition
No Ball Damage
Lifespan varies by test condition
- No Ball Damage
Easy To Repair Board
Hi Speed Test