이안컴퍼니

Products

ISB

  • Burn In Socket

    Provides customized, optimized solution through outstanding characteristics and structure, including Device No Ball Damage, PCB No Soldering, High Speed realization, etc., through rubber-applied Burn In Test Socket.

    Specifications
    DC BI Socket Normal BI Socket High Speed BI Socket
    Package Type

    BGA, LGA etc.

    BGA, LGA, QFN etc.

    BGA etc.
    Available Pitch

    0.3P~

    0.3P~

    0.8P~
    Characteristics

    Lifespan varies by test condition

    No Ball Damage

    Lifespan varies by test condition

    No Ball Damage

    Lifespan varies by test condition

    - No Ball Damage

    Easy To Repair Board

    Hi Speed Test
Product Series
Package Type

BGA, LGA etc

Pitch

0.3P~

Characteristics

Lifespan varies by test condition

No Ball Damage

Package Type

BGA, LGA, QFN etc

Pitch

0.3P~

Characteristics

Lifespan varies by test condition

No Ball Damage

High speed response

Package Type

BGA etc

Pitch

0.8P~

Characteristics

Lifespan varies by test condition

No Ball Damage

Easy to repair board