이안컴퍼니

Products

ISC

  • Memory Test Socket

    Provides optimized solution for all memory device/PKG and different test environments, from the smallest pitch ~ normal pitch (0.2P~1.0P).

    Specifications Package Type

    BGA, LGA, POP etc.

    Available Pitch

    0.2P~

    Characteristics

    Long life span.

    Low Cres, Low Contact force (Multi-PARA)

    High Speed, Low Powder, High Voltage Test Solution

    No Ball Damage

    Available For ESD

Product Series
Package Type

DDR

Pitch

0.3P~

Characteristics

Long life span

No Ball Damage

Available For ESD

Low Cres

Low Contents Force

Package Type

LPDDR

Pitch

0.2P~

Characteristics

Long life span

No Ball Damage

Available For ESD

High Speed

Low Powder

Package Type

NAND

Pitch

0.3P~

Characteristics

Long life span

No Long Test

No Ball Damage

High Speed

Dual Contact
(BGA+LGA)

Package Type

MCP

Pitch

0.3P~

Characteristics

Long life span

No Ball Damage

Available For ESD

High Speed

Low Powder

Low Cres

Package Type

DDR

Pitch

0.3P~

Characteristics

Long life span

Low Cres

Low Contact Force

Package Type

LPDDR

Pitch

0.2P~

Characteristics

Long life span

High Speed

Low Cres

Low Contact Force

Package Type

NAND

Pitch

0.3P~

Characteristics

Long life span

High Speed

Low Cres

Low Contact Force

Dual Contact
(BGA+LGA)

Package Type

NAND Flash

Pitch

0.4P~

Characteristics

Long life span

High Speed

Low Cres

Package Type

MCP

Pitch

0.3P~

Characteristics

Long life span

High Speed

Low Cres

Low Contact Force

  • Logic Test Socket

    Provides optimized solution for logic device/PKG test in accordance with the application, including long test time, short test time, high speed, large area, etc.

    Specifications Package Type

    BGA, LGA, QFN, QFP, CSP, SOP, TSOP etc.

    Available Pitch

    0.25P~

    Characteristics

    AP, CPU, GPU, PMIC, RF, Sensor, Mixed signal

    Validation, SLT, ATE

    Low Cres, High Speed, High Voltage Test Solution

    No Ball Damage

    Customizing Test

Product Series
Package Type

AP

Pitch

0.3P~

Characteristics

Long life span

No Ball Damage

Validation, SLT, ATE

High Speed

Low Cres

Low Contents Force

Package Type

CPU

Pitch

0.3P~

Characteristics

Long life span

No Ball Damage

Validation, SLT, ATE

High Speed

Low Cres

Low Contents Force

Package Type

GPU

Pitch

0.5P~

Characteristics

Long life span

No Ball Damage

Validation, SLT, ATE

High Speed

Low Cres

Low Contents Force

Package Type

BGA

Pitch

0.3P~

Characteristics

Long life span

Validation, SLT, ATE

High Speed

Low Cres

Low Contents Force

Package Type

LGA

Pitch

0.3P~

Characteristics

Long life span

Validation, SLT, ATE

High Speed

Low Cres

Low Contents Force

Package Type

QFP

Pitch

0.4P~

Characteristics

Long life span

High Speed

Low Cres

Package Type

QFN

Pitch

0.35P~

Characteristics

Long life span

High Speed

Low Cres