Products

ISTCU

  • Camera Module Socket

    ISCのAuto Socketは、お客様のNeedsに合った様々な形で製作できます。 また、テストソケット市場での長年の経験に基づいて、最高レベルのコンタクト性と耐久性を保証し、従来とは異なる新概念の駆動方式を保有しています。

    Specifications
    CCM Auto Socket MEMS Probe Head
    Package Type

    Bottom Move

    Top Move

    Available Pitch

    0.3, 0.35mm~

    0.3, 0.35mm~

    Characteristics

    Non-Magnetic

    Non-Magnetic

Product Series
Package Type

Around View

Pitch

0.35mm~

Characteristics

Non-Magnetic

Package Type

Twin VCM

Pitch

0.35mm~

Characteristics

Non-Magnetic

Package Type

VCM Module

Pitch

0.35mm~

Characteristics

Non-Magnetic

Package Type

Single Module

Pitch

0.35mm~

Characteristics

Non-Magnetic

Package Type

Triple Module

Pitch

0.35mm~

Characteristics

Non-Magnetic

Package Type

VCM Module

Pitch

0.35mm~

Characteristics

Non-Magnetic

  • Interposer

    ISC Interposerは、高いContact安定性を備え、顧客の要求に応じてSpecial Rubber Solutionを適用するオーダーメイドの製品です。

    Specifications Package Type

    Board to Board, Probe card etc

    Available Pitch

    0.4P ~

    Characteristics

    High contact stability

    No board damage

    No bending

    Low force, Low Cres

Product Series
Package Type

B to B

Pitch

0.4P~

Characteristics

High contact stabilituy

No board damage

No bending

Low force, Low Cres

Package Type

Probe Card

Pitch

0.4P~

Characteristics

High contact stabilituy

No board damage

No bending

Low force, Low Cres

  • Test Fixture

    Rubber、POGO Socketを使用したMobile、D-TV、Network、Module、etc… 様々なパッケージに対するSystem Test Solution対応が可能です。

    Specifications Package Type

    BGA, LGA, QFN etc

    Available Pitch

    0.3P~

    Characteristics

    Mobile Application Processor

    PMIC, RFIC, Memory IC, NFC

    Module, SSD, etc

Product Series
Package Type

748FBGA, 168FBGA

Pitch

0.4P~

Characteristics

Mobile AP + LPDDR Test

Package Type

64FBGA

Pitch

0.4P~

Characteristics

Mobile NFC Test

Package Type

96FBGA

Pitch

0.8P~

Characteristics

SSD Test

Package Type

556FBGA

Pitch

0.4P~

Characteristics

Mobile LPDDR Test

Package Type

153FBGA

Pitch

0.5P~

Characteristics

Navigation Test

Package Type

16LGA

Pitch

0.5P~

Characteristics

RF Chip Test

Package Type

556FBGA

Pitch

0.8P~

Characteristics

Module Test

Package Type

929FCPBGA

Pitch

0.75P~

Characteristics

D-TV Test

Package Type

48TSOP, 48QFP

Pitch

0.5P~

Characteristics

USB Test

  • Board Saver

    ISCボードセーバーは、プローブからPCBパッドのダメージを最小限に抑えます。 さらに、ボードセーバーの金メッキパーティクルは、使用中のPCBでもテスト歩留まりを大幅に向上させます。

    Specifications Package Type

    All including BGA, QFN, QFP, TSSOP and etc

    Available Pitch

    0.35mm~

    Characteristics

    Minimize damage on PCB Pad

    Improve Test Yield

    Available for re-routing

    Simple installment and maintenance

  • Chiller
    Specifications
    Target Temp

    -40 ~ 120℃

    Heating Capacity.

    120℃ @360w

    Cooling Capacity(1Peltier)

    -40℃ @40w

    Cooling Capacity(2Peltier)

    -40℃ @80w

    Accuracy

    Target Temp±1℃

    Ramp Time(120℃ → -40℃)

    About 5min 30sec (±60sec)

    Ramp Time(-40℃ → 120℃)

    About 1min 30sec (±60sec)

    Power

    220V 50/60Hz
    (Max.5A@40w Controller
    Mx.10A@80w Controller)

    Dew point temperature

    Supply -30℃ Dry Air(40Lpm/1Dut)

    Need 1 chiller per 1 Thermal Head

  • Thermal Head + Controller
    (80W@-40℃ Type)
    Specifications
    Target Temp

    -40 ~ 120℃

    Heating Capacity.

    120℃ @360w

    Cooling Capacity(1Peltier)

    -40℃ @40w

    Cooling Capacity(2Peltier)

    -40℃ @80w

    Accuracy

    Target Temp±1℃

    Ramp Time(120℃ → -40℃)

    About 5min 30sec (±60sec)

    Ramp Time(-40℃ → 120℃)

    About 1min 30sec (±60sec)

    Power

    220V 50/60Hz
    (Max.5A@40w Controller
    Mx.10A@80w Controller)

    Dew point temperature

    Supply -30℃ Dry Air(40Lpm/1Dut)

    Need 1 chiller per 1 Thermal Head

  • Thermal Head + Controller
    (40W@-40℃ Type)
    Specifications
    Target Temp

    -40 ~ 120℃

    Heating Capacity.

    120℃ @360w

    Cooling Capacity(1Peltier)

    -40℃ @40w

    Cooling Capacity(2Peltier)

    -40℃ @80w

    Accuracy

    Target Temp±1℃

    Ramp Time(120℃ → -40℃)

    About 5min 30sec (±60sec)

    Ramp Time(-40℃ → 120℃)

    About 1min 30sec (±60sec)

    Power

    220V 50/60Hz
    (Max.5A@40w Controller
    Mx.10A@80w Controller)

    Dew point temperature

    Supply -30℃ Dry Air(40Lpm/1Dut)

    Need 1 chiller per 1 Thermal Head