이안컴퍼니

Products

ISP

  • Probe Head

    High Technology POGO Probeと超精密加工プレートの組み合わせで最適化されたWafer Probing Solutionを提供します。 MEMSプロセスを適用した高性能MEMS Probe Headは、Low Force、High CCC、高強度マテリアルの優れたContact特性で、お客様ごとのカスタムSolution対応が可能です。

    Specifications
    POGO Probe Head MEMS Probe Head
    Package Type

    Wafer (WLCSP)

    Wafer (SOC)
    Available Pitch

    120um~

    80um~
    Characteristics

    RF type, Signal length
    2.0mm

    Solder Bump

    Wafer Probing &
    Single Die TEST

    High CCC > 1A

    Copper Pillar (Flat type)

    Wire Bond Pad
    (Point Type)
Product Series
Package Type

Solder Bump

Pitch

120um

Characteristics

Signal Path < 2mm

8site 1skip

Package Type

Wire-bond Pad

Pitch

80um

Characteristics

MEMS Point Tip (Rh)

Stable Contact

Package Type

Copper Pillar

Pitch

80um

Characteristics

High CCC > 1A

Low Force Contact

  • Pyramid PIN

    Dut Side Of ContactをMEMSプロセスを適用して製作したPyramid PINはHigh Hardness（Hv1000）で耐摩耗性、Sharp Contact TipでContact特性に優れ、お客様ごとのカスタムSolution対応が可能です。

    Specifications
    POGO Probe Head MEMS Probe Head
    Package Type

    Wafer (WLCSP)

    Wafer (SOC)
    Available Pitch

    120um~

    80um~
    Characteristics

    RF type, Signal length
    2.0mm

    Solder Bump

    Wafer Probing &
    Single Die TEST

    High CCC > 1A

    Copper Pillar (Flat type)

    Wire Bond Pad
    (Point Type)
  • Battery PIN

    最高の技術とノウハウを基に、Lithium-Polymer Batteryの充電および放電テストに適したSolutionを提供します。

    Specifications
    POGO Probe Head MEMS Probe Head
    Package Type

    Wafer (WLCSP)

    Wafer (SOC)
    Available Pitch

    120um~

    80um~
    Characteristics

    RF type, Signal length
    2.0mm

    Solder Bump

    Wafer Probing &
    Single Die TEST

    High CCC > 1A

    Copper Pillar (Flat type)

    Wire Bond Pad
    (Point Type)
Product Series
Package Type

QFP

Pitch

0.4P

Characteristics

Long life span

Increased reliability of test

Reduction of maintenance

Reduction of re-test operation

Current

15A

Characteristics

Sleeve type

Package Type

BGA

Pitch

0.35P~

Characteristics

Long life span

Increased reliability of test

Reduction of maintenance

Reduction of re-test operation

Package Type

LGA

Pitch

0.35P~

Characteristics

Long life span

Increased reliability of test

Reduction of maintenance

Reduction of re-test operation

Package Type

QFN

Pitch

0.35P~

Characteristics

Long life span

Increased reliability of test

Reduction of maintenance

Reduction of re-test operation

  • RF Socket

    最小Pitch〜Normal Pitch（0.2P〜1.0P）まで、すべてのメモリデバイス/ PKGおよびさまざまなテスト環境に合わせて最適化されたソリューションを提供します。

    Specifications
    Coaxial Socket RF Probe
    Package Type

    FBGA, LGA, QFN, WLCSP etc
    Available Pitch

    0.7P~

    0.4P~
    Characteristics

    50Ω Impedance Matching

    Coaxial Structure

    40GHz Bandwidth

    Short Probe

    G-S-G > 40GHz @ -1dB

    Low Inductance

    Low CRES
Product Series
Package Type

BGA, LGA

Pitch

0.7P~

Characteristics

Air Coaxial Structure

Impedeance 50Q

Insertion Loss 40Ghz@ - 1dB

Return Loss 40Ghz@ - 1dB

Package Type

BGA, LGA, QFN

Pitch

0.3P~

Characteristics

Short Probe

G-S-G > 40Ghz@ - 1dB

Low Inductance

Low CRES