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Burn In Socket
Rubberを応用したBurn In Test Socketで、Device No Ball Damage、PCB No Soldering、Hi Speed実装など優れた特性と構造で、お客様に合わせた最適化されたSolutionを提供します。
SpecificationsDC BI Socket Normal BI Socket High Speed BI Socket Package Type BGA, LGA etc.
BGA, LGA, QFN etc.
BGA etc.
Available Pitch 0.3P~
0.3P~
0.8P~
Characteristics Lifespan varies by test condition
No Ball Damage
Lifespan varies by test condition
No Ball Damage
Lifespan varies by test condition
- No Ball Damage
Easy To Repair Board
Hi Speed Test