이안컴퍼니

Products

ISB

  • Burn In Socket

    Rubberを応用したBurn In Test Socketで、Device No Ball Damage、PCB No Soldering、Hi Speed実装など優れた特性と構造で、お客様に合わせた最適化されたSolutionを提供します。

    Specifications
    DC BI Socket Normal BI Socket High Speed BI Socket
    Package Type

    BGA, LGA etc.

    BGA, LGA, QFN etc.

    BGA etc.
    Available Pitch

    0.3P~

    0.3P~

    0.8P~
    Characteristics

    Lifespan varies by test condition

    No Ball Damage

    Lifespan varies by test condition

    No Ball Damage

    Lifespan varies by test condition

    - No Ball Damage

    Easy To Repair Board

    Hi Speed Test
Product Series
Package Type

BGA, LGA etc

Pitch

0.3P~

Characteristics

Lifespan varies by test condition

No Ball Damage

Package Type

BGA, LGA, QFN etc

Pitch

0.3P~

Characteristics

Lifespan varies by test condition

No Ball Damage

High speed response

Package Type

BGA etc

Pitch

0.8P~

Characteristics

Lifespan varies by test condition

No Ball Damage

Easy to repair board