Products

ISP

  • Probe Head

    适用 Mems 工艺的高性能 Mems Probe Head,以 low force, high CCC, 高强度 material 的优秀 contact 特性,可提供顾客定制型 solution。

    Specifications
    POGO Probe Head MEMS Probe Head
    Package Type

    Wafer (WLCSP)

    Wafer (SOC)

    Available Pitch

    120um~

    80um~

    Characteristics

    RF type, Signal length
    2.0mm

    Solder Bump

    Wafer Probing &
    Single Die TEST

    High CCC > 1A

    Copper Pillar (Flat type)

    Wire Bond Pad
    (Point Type)

Product Series
Package Type

Solder Bump

Pitch

120um

Characteristics

Signal Path < 2mm

8site 1skip

Package Type

Wire-bond Pad

Pitch

80um

Characteristics

MEMS Point Tip (Rh)

Stable Contact

Package Type

Copper Pillar

Pitch

80um

Characteristics

High CCC > 1A

Low Force Contact

  • Pyramid PIN

    Pyramid PIN是High hardness (Hv1000), 具有耐磨损性, Sharp contact tip, Contact特性优秀,可提供顾客定制型solution。

    Specifications
    POGO Probe Head MEMS Probe Head
    Package Type

    Wafer (WLCSP)

    Wafer (SOC)

    Available Pitch

    120um~

    80um~

    Characteristics

    RF type, Signal length
    2.0mm

    Solder Bump

    Wafer Probing &
    Single Die TEST

    High CCC > 1A

    Copper Pillar (Flat type)

    Wire Bond Pad
    (Point Type)

  • Battery PIN

    基于最好的技术和诀窍,锂聚合物电池 适用于充放电测试。

    Specifications
    POGO Probe Head MEMS Probe Head
    Package Type

    Wafer (WLCSP)

    Wafer (SOC)

    Available Pitch

    120um~

    80um~

    Characteristics

    RF type, Signal length
    2.0mm

    Solder Bump

    Wafer Probing &
    Single Die TEST

    High CCC > 1A

    Copper Pillar (Flat type)

    Wire Bond Pad
    (Point Type)

Product Series
Package Type

QFP

Pitch

0.4P

Characteristics

Long life span

Increased reliability of test

Reduction of maintenance

Reduction of re-test operation

Current

15A

Characteristics

Sleeve type

Package Type

BGA

Pitch

0.35P~

Characteristics

Long life span

Increased reliability of test

Reduction of maintenance

Reduction of re-test operation

Package Type

LGA

Pitch

0.35P~

Characteristics

Long life span

Increased reliability of test

Reduction of maintenance

Reduction of re-test operation

Package Type

QFN

Pitch

0.35P~

Characteristics

Long life span

Increased reliability of test

Reduction of maintenance

Reduction of re-test operation

  • RF Socket

    以独有的技术力,同轴结构,配对阻抗, 提供对应优秀特性及高频率的RF测试座。

    Specifications
    Coaxial Socket RF Probe
    Package Type

    FBGA, LGA, QFN, WLCSP etc

    Available Pitch

    0.7P~

    0.4P~

    Characteristics

    50Ω Impedance Matching

    Coaxial Structure

    40GHz Bandwidth

    Short Probe

    G-S-G > 40GHz @ -1dB

    Low Inductance

    Low CRES

Product Series
Package Type

BGA, LGA

Pitch

0.7P~

Characteristics

Air Coaxial Structure

Impedeance 50Q

Insertion Loss 40Ghz@ - 1dB

Return Loss 40Ghz@ - 1dB

Package Type

BGA, LGA, QFN

Pitch

0.3P~

Characteristics

Short Probe

G-S-G > 40Ghz@ - 1dB

Low Inductance

Low CRES