Products

ISTIU

  • Logic Burn-In Board
    Specifications

    Maker

    Model

    Unitest

    U940A, U938, U930

    Digital
    Frontier

    DF2200, FOS1540

    AEHR

    ABTS-Pi

  • Memory Burn-In Board
    Specifications

    Maker

    Model

    Unitest

    U940A, U938, U930

    Digital
    Frontier

    DF2200, FOS1540

    AEHR

    ABTS-Pi

  • U940A High-speed Burn-In Board
    Specifications
    Pakage Type

    DDR4, LPDDR4, GDDR6

    Layer

    16L

    Thickness

    2.4T

    Material

    Polymide

    Pad Pitch

    0.8mm

    Impedance

    40,50Ω​

    Aspect Ratio

    10

    Finish

    ENIG

  • DF2200 High-speed Burn-In Board
    Specifications
    Pakage Type

    NAND, uMCP

    Layer

    16L

    Thickness

    2.1T ± 10%

    Material

    Polymide

    Pad Pitch

    0.8mm

    Impedance

    50Ω ± 10%

    Aspect Ratio

    10

    Finish

    ENIG

  • ABTS-Pi Logic Burn-In Board
    Specifications
    Pakage Type

    SoC, AP

    Layer

    18L

    Thickness

    2.4T

    Material

    Polymide

    Pad Pitch

    0.4mm

    Impedance

    50Ω ± 10%

    Aspect Ratio

    16

    Finish

    ENIG

  • HI-FIX & DSA Board
    Specifications

    Maker

    Model

    Advantest

    T5375, T5377, T5581, T5585, T5588, T5593, T5503A, T5503HS

    Teradyne

    Magnum-1, Magnum-2x, Magnum-3, Magnum-V, Magnum-VU, Magnum-epic, HPC-10K, HPM

  • Advantest T5588 DSA Board
    Specifications
    Pakage Type

    DDR4, LPDDR4, GDDR6

    Layer

    30L

    Thickness

    4.0T

    Material

    Nelco-13si

    Pad Pitch

    0.25mm

    Impedance

    50, 100Ω

    Aspect Ratio

    25

    Finish

    ENIG

  • Teradyne Magnum5 DSA Board
    Specifications
    Pakage Type

    NAND, uMCP

    Layer

    32L

    Thickness

    5.0T

    Material

    Nelco-13si

    Pad Pitch

    0.5mm

    Impedance

    50, 100Ω

    Aspect Ratio

    25

    Finish

    ENIG

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