Products

ISTCU

  • Camera Module Socket

    ISC의 Auto Socket은 고객의 Needs에 부합하는 다양한 형태로 제작 할 수 있습니다. 또한 테스트 소켓 시장에서의 오랜 경험을 토대로 최고 수준의 Contact성과 내구성을 보장하며 기존과 다른 신개념의 구동 방식을 보유하고 있습니다.

    Specifications
    CCM Auto Socket MEMS Probe Head
    Package Type

    Bottom Move

    Top Move

    Available Pitch

    0.3, 0.35mm~

    0.3, 0.35mm~

    Characteristics

    Non-Magnetic

    Non-Magnetic

Product Series
Package Type

Around View

Pitch

0.35mm~

Characteristics

Non-Magnetic

Package Type

Twin VCM

Pitch

0.35mm~

Characteristics

Non-Magnetic

Package Type

VCM Module

Pitch

0.35mm~

Characteristics

Non-Magnetic

Package Type

Single Module

Pitch

0.35mm~

Characteristics

Non-Magnetic

Package Type

Triple Module

Pitch

0.35mm~

Characteristics

Non-Magnetic

Package Type

VCM Module

Pitch

0.35mm~

Characteristics

Non-Magnetic

  • Interposer

    ISC Interposer는 높은 Contact 안정성을 갖추며 고객의 요구사항에 따라 Special Rubber Solution을 적용하는 주문 제작형 제품입니다.

    Specifications Package Type

    Board to Board, Probe card etc

    Available Pitch

    0.4P ~

    Characteristics

    High contact stability

    No board damage

    No bending

    Low force, Low Cres

Product Series
Package Type

B to B

Pitch

0.4P~

Characteristics

High contact stabilituy

No board damage

No bending

Low force, Low Cres

Package Type

Probe Card

Pitch

0.4P~

Characteristics

High contact stabilituy

No board damage

No bending

Low force, Low Cres

  • Test Fixture

    Rubber, POGO Socket을 사용한 Mobile, D-TV, Network, Module, etc… 다양한 Package에 대한 System Test Solution 대응이 가능합니다.

    Specifications Package Type

    BGA, LGA, QFN etc

    Available Pitch

    0.3P~

    Characteristics

    Mobile Application Processor

    PMIC, RFIC, Memory IC, NFC

    Module, SSD, etc

Product Series
Package Type

748FBGA, 168FBGA

Pitch

0.4P~

Characteristics

Mobile AP + LPDDR Test

Package Type

64FBGA

Pitch

0.4P~

Characteristics

Mobile NFC Test

Package Type

96FBGA

Pitch

0.8P~

Characteristics

SSD Test

Package Type

556FBGA

Pitch

0.4P~

Characteristics

Mobile LPDDR Test

Package Type

153FBGA

Pitch

0.5P~

Characteristics

Navigation Test

Package Type

16LGA

Pitch

0.5P~

Characteristics

RF Chip Test

Package Type

556FBGA

Pitch

0.8P~

Characteristics

Module Test

Package Type

929FCPBGA

Pitch

0.75P~

Characteristics

D-TV Test

Package Type

48TSOP, 48QFP

Pitch

0.5P~

Characteristics

USB Test

  • Board Saver

    ISC Board Saver는 Probe로부터 PCB 패드의 데미지를 최소화 시켜줍니다. 또한, Board Saver의 금 도금 파티클은 사용중인 PCB에서도 테스트 수율을 크게 향상 시킵니다.

    Specifications Package Type

    All including BGA, QFN, QFP, TSSOP and etc

    Available Pitch

    0.35mm~

    Characteristics

    Minimize damage on PCB Pad

    Improve Test Yield

    Available for re-routing

    Simple installment and maintenance

  • Chiller
    Specifications
    Target Temp

    -40 ~ 120℃

    Heating Capacity.

    120℃ @360w

    Cooling Capacity(1Peltier)

    -40℃ @40w

    Cooling Capacity(2Peltier)

    -40℃ @80w

    Accuracy

    Target Temp±1℃

    Ramp Time(120℃ → -40℃)

    About 5min 30sec (±60sec)

    Ramp Time(-40℃ → 120℃)

    About 1min 30sec (±60sec)

    Power

    220V 50/60Hz
    (Max.5A@40w Controller
    Mx.10A@80w Controller)

    Dew point temperature

    Supply -30℃ Dry Air(40Lpm/1Dut)

    Need 1 chiller per 1 Thermal Head

  • Thermal Head + Controller
    (80W@-40℃ Type)
    Specifications
    Target Temp

    -40 ~ 120℃

    Heating Capacity.

    120℃ @360w

    Cooling Capacity(1Peltier)

    -40℃ @40w

    Cooling Capacity(2Peltier)

    -40℃ @80w

    Accuracy

    Target Temp±1℃

    Ramp Time(120℃ → -40℃)

    About 5min 30sec (±60sec)

    Ramp Time(-40℃ → 120℃)

    About 1min 30sec (±60sec)

    Power

    220V 50/60Hz
    (Max.5A@40w Controller
    Mx.10A@80w Controller)

    Dew point temperature

    Supply -30℃ Dry Air(40Lpm/1Dut)

    Need 1 chiller per 1 Thermal Head

  • Thermal Head + Controller
    (40W@-40℃ Type)
    Specifications
    Target Temp

    -40 ~ 120℃

    Heating Capacity.

    120℃ @360w

    Cooling Capacity(1Peltier)

    -40℃ @40w

    Cooling Capacity(2Peltier)

    -40℃ @80w

    Accuracy

    Target Temp±1℃

    Ramp Time(120℃ → -40℃)

    About 5min 30sec (±60sec)

    Ramp Time(-40℃ → 120℃)

    About 1min 30sec (±60sec)

    Power

    220V 50/60Hz
    (Max.5A@40w Controller
    Mx.10A@80w Controller)

    Dew point temperature

    Supply -30℃ Dry Air(40Lpm/1Dut)

    Need 1 chiller per 1 Thermal Head